Computer Hardware Terms, Glossary and Dictionary

Flip Chip Pin Grid Array (FC-PGA or FCPGA) is the package of certain Intel Celeron, Pentium III, and Pentium 4 microprocessors. FC-PGA processors fit into Socket 370 or Socket 478 motherboard sockets. FC-PGA packages use chips that have been turned upside down and attached to the package or the board using solder balls instead of perimeter bonding wires. The solder balls are jointed directly to a set of solder balls on the substrate. The exposed core rests on the actual package, and the chips make direct contact with the heat sink. This allows for more efficient cooling to take place. Since the chips are placed directly on the board, FC-PGA packages have a high I/O density and shorter electrical connections than other types of packaging.

Related Terms

FC-PGA: Flip Chip Pin Grid Array